ADVANCED PACKAGING

FMi specializes in innovative engineering solutions in PCB assembly

SMT Highlights
  • Quick turnaround for surface mount assembly on flexible substrates, PCB, Ceramic, FR4 and flexible substrates
  • BGA, QFP, CSP, Fine Pitch ICs, 0201 components
  • Double sided boards, Highly density boards

Through hole
  • Wave soldering application
  • Dense multilayer double sided PCB

Wirebonding
  • Chip on flex or PCB in combination with SMT for precision packaging
  • Offers both gold and aluminum wedge bonding
  • Glob top

Electromechanical Assembly
  • Complex box builds
  • Comprehensive machining services
  • EDM
  • CNC machining and tuning centers