Prototype and low volume: We provide 20000 sq.ft. Class 10000 manufacturing facility with full SMT, Flip-chip, Wirebonding and mechanical assembly capabilities.

  • Vertically Integrated custom solutions
  • Engineering Services
  • Screen-printing
  • Pick-n-place
  • Universal GSM1 pick-n-place
  • Mydata pick-n-place
  • 0201 placement capability
  • Reflow
  • Heller 1700 reflow oven
  • Wirebonding
  • New Era Wave Solder
  • Aluminum/Gold Wedge bonding
  • Hand/Eye reference to bond targets and elevations
  • Flip Chip
  • Semi-automatic flip chip placement system
  • ACF
  • Anisotropic Conductive Film Bondingm
  • Hot Bar
  • Semi automated Hot bar
  • Testing
  • HP 3070 System
  • ICT test
  • Functional Test
  • Panel Test
  • Reliability Testing
  • Qual Mark HALT and HASS Testing
  • Thermotron TC Oven
Mydata Pick and PlaceEpoxy DispensingEpoxy DispensingQual HALT and HASS test ChamberWire Bonder